Chinese Government Scholarship-High-level Postgraduate Program is a full scholarship established by the Ministry of Education, P.R.C. to support designated Chinese universities to enroll outstanding international students for postgraduate studies in China.
The Chinese Government Scholarship “High-Level Postgraduate” program is a full scholarship provided by the Ministry of Education of China to some high-level universities in China. It is used by universities to select and recruit outstanding young foreign students to pursue postgraduate degrees in China.
Benefits
Full Tuition Coverage: No fees for your academic program.
Accommodation: Free housing in the university dormitory or a housing allowance.
Monthly Stipend:
Master’s students: CNY 3,000/month
Doctoral students: CNY 3,500/month
Comprehensive Medical Insurance: Covers all major medical expenses.
Requirements
● Be a citizen of a country other than the PRC and in good health both mentally and physically;
● Be an academically excellent holder of a bachelor’s degree under the age of 35 when applying for a master’s program;
● Be an academically excellent holder of a master’s degree under the age of 40 when applying for a doctoral program;
● Have passed the HSK (Level 4) when applying for a Chinese-taught postgraduate program;
● Have TOEFL 90+ or IELTS 6.5+ when applying for an English-taught postgraduate program ( for non-native English speakers);
● Meet the university’s admission requirements in terms of academic ability and other relevant criteria.
○ Application Documents
○ Application Form
○ Copy of Passport Home Page
○ Notarized the highest diploma
○ Academic transcripts (from the undergraduate program onwards).
○ Language qualification certificates
○ A study plan proposal
○ Recommendation letters
○ A photocopy of the Foreigner Physical Examination Form completed in English
○ Non-criminal record report
○ Provisional acceptance letter issued by CPU professors (download the form: http://international.cpu.edu.cn/366/list.htm)
Method of Application
For More Information,
Application Deadline: February 20, 2025.
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